Tape for dicing process
【Dicing Process】
In dicing process (cutting wafer IC chip size), dicing tape is required to protect and fix wafer. Superior in expanding, non-staining, anti-static, you can pick up wafer easily.
| FEATURES |
| Expanding | Because of good expandings, easy to pick up wafer. |
| Non-Stanning | Because of high function adhesive, non-stanning on wafer. |
| Anti Static | Does not suck dust due to anti static property. |
| Adhesion | We can design adhesion force depending on the size of wafers. |
| STANDARD PRODUCT |
| Product Code | Adhesion Force(N/25mm) | Base Material | Separator | Color of Base Material |
| DIE-120 | 2 | PVC | OPP | BLUE |
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Each company has know how in their dicing process, so we may not be able to meet the demand in all production lines of all customers indiscriminately. Accordingly, we will establish methods to meet the demand after discussing the production line property of each customer. |
【For any inquiry, please feel free to contact us.】
Regarding inquiry for product, please kindly contact us by daiwa-info@daiwakaseishoji.co.jp
You can also contact us by mail website inquiry.
For your inquiry, basically we will reply within one working day. With regard to inquiry received after 18:00 PM, on Saturdays, on Sundays, on holidays, we might reply after one working day.
Please kindly understand.
